Ningbo Oriental Mecha & Elec
Precision in Every Dimension. Security for Every Border.
Automatic control, intelligent judgment
automatically measure the AC magnetic parameters of Fe-Si-Al, Fe-Al, soft ferrite, permalloy, amorphous/nanocrystalline and silicon steel under the frequency of 40Hz~300kHz (continuous frequency)
Learn More >
accurately measure the AC parameters of soft magnets
MATS-3110M Hysteresisgraph is suitable for measuring dynamic magnetic parameters of soft magnetic materials.
Learn More >

Scanning Acoustic Microscopy (SAM) has become an indispensable non-destructive testing technique in semiconductor laboratories. It is widely applied for internal defect detection and quality evaluation of chip samples. Utilizing high-frequency ultrasonic waves, SAM penetrates the chip packaging and layered internal structures without causing any damage to the specimens. It effectively identifies typical hidden defects such as delamination, voids, cracks, debonding and interface separation inside semiconductor chips. Compared with traditional detection methods, it features high resolution, full non-destruction and intuitive imaging capability. In routine laboratory research and mass sample screening, SAM enables researchers and engineers to visualize internal structural anomalies of chips, analyze defect distribution and root causes, verify packaging reliability, and screen unqualified products at an early stage. It provides critical technical support for chip process optimization, failure analysis and batch quality control in semiconductor R&D and production laboratories.

It is designed for laboratory sample analysis, production line batch inspection, and is widely applied in schools, research institutes and other similar institutions.

It is designed for laboratory sample analysis, production line batch inspection, and is widely applied in schools, research institutes and other similar institutions.
