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Ningbo Oriental Mecha & Elec
Precision in Every Dimension. Security for Every Border.
UST300A Scanning Acoustic Microscope
Scanning Acoustic Microscope is developed for inspection of the internal defect location, size and distribution in the semiconductor packages or materials using high frequency ultrasonic waves. It is very sensitive to bonding layer, so it can discover air holes, flaws, impurities and delaminations, etc.
Scanning Acoustic Microscope is a kind of non-destructive device which can display waveforms and high resolution images of the inner of inspected objects, and can reserve small defects lost in destructive inspection.
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MATS-3110SA Hysteresisgraph
Automatic control, intelligent judgment
Automatically measure the AC magnetic parameters of Fe-Si-Al, Fe-Al, soft ferrite, permalloy, amorphous/nanocrystalline and silicon steel under the frequency of 40Hz~300kHz (continuous frequency)
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MATS-3110M Hysteresisgraph
accurately measure the AC parameters of soft magnets
MATS-3110M Hysteresisgraph is suitable for measuring dynamic magnetic parameters of soft magnetic materials.
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APPLICATIONS
Application of Scanning Acoustic Microscope (SAM) in PBGA Packaging
The Scanning Acoustic Microscope (SAM) plays a critical role in Plastic Ball Grid Array (PBGA) packaging. It ensures packaging quality and reliability through non-destructive imaging of the internal packaging structure. Its main applications are as follows: 1. Solder Joint Quality Inspection Detects solder joint defects between the chip and substrate, such as cold solder, voids, cracks, or insufficient solder. By analyzing differences in the energy of ultrasonic waves reflected at material interfaces, abnormal soldering areas can be precisely located. 2. Delamination Defect Identification Identifies delamination between the plastic encapsulant and the chip, substrate, or copper wires. Ultrasonic waves reflect strongly at delamination interfaces (air gaps), generating clear C-scan images that visually display the location, area, and morphology of delaminations. 3. Void Defect Detection Finds micro-voids inside the plastic encapsulation material or at interfaces. These voids appear as bright highlight signal points in acoustic images. Their size and distribution density can be evaluated via C-scan or T-scan modes. 4. Material Interface Integrity Assessment Analyzes the bonding state between different material layers (e.g., chip, solder, substrate, plastic encapsulant). Differences in the response of ultrasonic waves to interfaces of materials with varying acoustic impedances can reveal potential poor bonding or contamination issues. 5. Technical Advantages Over Traditional Methods Non-destructive: Requires no physical cutting or chemical etching, preserving sample integrity and electrical performance. High-resolution imaging: Provides micron-level precision internal 2D (C-scan) or 3D tomographic images for precise defect localization. Quantitative analysis: Accurately measures defect area, depth, and position, supporting quality classification standards. Efficiency and applicability: Suitable for mass production line testing. More sensitive to interface delamination compared to destructive methods (e.g., sectioning) or X-ray inspection. 6. Progress in Domestic Production Chinese enterprises have achieved significant breakthroughs in SAM core technology, breaking foreign monopolies. Jiao Cheng Ultrasonic: Developed 2.5D/3D advanced packaging SAM, mastering high-frequency sound generation, signal processing, and imaging algorithms. Shan Tou Ultrasonic: Independently developed the CTS-SAM series with self-developed high-frequency pulse transceivers, achieving full localization of core components. Core Technology Breakthrough: Domestic SAMs have exceeded 100 MHz operating frequency, reaching up to 175 MHz, enabling micron-level defect detection. Market Impact: Domestic equipment is 40% lower in price than imported brands, accelerating penetration in the mid-to-low-end market and supporting the localization of semiconductor advanced packaging testing.
Application of Scanning Acoustic Microscopy (SAM) in Laboratory for Chip Defect Inspection
Scanning Acoustic Microscopy (SAM) has become an indispensable non-destructive testing technique in semiconductor laboratories. It is widely applied for internal defect detection and quality evaluation of chip samples. Utilizing high-frequency ultrasonic waves, SAM penetrates the chip packaging and layered internal structures without causing any damage to the specimens. It effectively identifies typical hidden defects such as delamination, voids, cracks, debonding and interface separation inside semiconductor chips. Compared with traditional detection methods, it features high resolution, full non-destruction and intuitive imaging capability. In routine laboratory research and mass sample screening, SAM enables researchers and engineers to visualize internal structural anomalies of chips, analyze defect distribution and root causes, verify packaging reliability, and screen unqualified products at an early stage. It provides critical technical support for chip process optimization, failure analysis and batch quality control in semiconductor R&D and production laboratories.
Schools, Research Institutes
It is designed for laboratory sample analysis, production line batch inspection, and is widely applied in schools, research institutes and other similar institutions.
GLOBAL SUPPLIER OF
INDUSTRIAL PROCESS SOLUTION & SERVICES
Ningbo Oriental Mecha & Elec Technology Co.,Ltd We don't just supply equipment; we provide the "Eyes of Industry." Based in the global logistics hub of Ningbo, we serve as a vital link in the international industrial chain, specializing in the export of high-precision testing and security technologies.
With a deep understanding of the rigorous standards in Europe, the Middle East, and Russia, we have curated a portfolio of solutions that empower manufacturers to achieve zero-defect production and critical infrastructure to maintain absolute security. Our commitment is simple: Uncompromising Quality, Global Compliance, and Seamless Logistics.
