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Ningbo Oriental Mecha & Elec
Precision in Every Dimension. Security for Every Border.
UST300A Scanning Acoustic Microscope
Scanning Acoustic Microscope is developed for inspection of the internal defect location, size and distribution in the semiconductor packages or materials using high frequency ultrasonic waves. It is very sensitive to bonding layer, so it can discover air holes, flaws, impurities and delaminations, etc.
Scanning Acoustic Microscope is a kind of non-destructive device which can display waveforms and high resolution images of the inner of inspected objects, and can reserve small defects lost in destructive inspection.
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MATS-3110SA Hysteresisgraph
Automatic control, intelligent judgment
Automatically measure the AC magnetic parameters of Fe-Si-Al, Fe-Al, soft ferrite, permalloy, amorphous/nanocrystalline and silicon steel under the frequency of 40Hz~300kHz (continuous frequency)
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MATS-3110M Hysteresisgraph
accurately measure the AC parameters of soft magnets
MATS-3110M Hysteresisgraph is suitable for measuring dynamic magnetic parameters of soft magnetic materials.
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APPLICATIONS
Application of Scanning Acoustic Microscope (SAM) in PBGA Packaging
The Scanning Acoustic Microscope (SAM) plays a critical role in Plastic Ball Grid Array (PBGA) packaging. It ensures packaging quality and reliability through non-destructive imaging of the internal packaging structure. Its main applications are as follows:
Application of Scanning Acoustic Microscopy (SAM) in Laboratory for Chip Defect Inspection
Scanning Acoustic Microscopy (SAM) has become an indispensable non-destructive testing technique in semiconductor laboratories. It is widely applied for internal defect detection and quality evaluation of chip samples. Utilizing high-frequency ultrasonic waves, SAM penetrates the chip packaging and layered internal structures without causing any damage to the specimens. It effectively identifies typical hidden defects such as delamination, voids, cracks, debonding and interface separation inside semiconductor chips. Compared with traditional detection methods, it features high resolution, full non-destruction and intuitive imaging capability. In routine laboratory research and mass sample screening, SAM enables researchers and engineers to visualize internal structural anomalies of chips, analyze defect distribution and root causes, verify packaging reliability, and screen unqualified products at an early stage. It provides critical technical support for chip process optimization, failure analysis and batch quality control in semiconductor R&D and production laboratories.
Schools, Research Institutes
It is designed for laboratory sample analysis, production line batch inspection, and is widely applied in schools, research institutes and other similar institutions.
GLOBAL SUPPLIER OF
INDUSTRIAL PROCESS SOLUTION & SERVICES
Ningbo Oriental Mecha & Elec Technology Co.,Ltd We don't just supply equipment; we provide the "Eyes of Industry." Based in the global logistics hub of Ningbo, we serve as a vital link in the international industrial chain, specializing in the export of high-precision testing and security technologies.
With a deep understanding of the rigorous standards in Europe, the Middle East, and Russia, we have curated a portfolio of solutions that empower manufacturers to achieve zero-defect production and critical infrastructure to maintain absolute security. Our commitment is simple: Uncompromising Quality, Global Compliance, and Seamless Logistics.
